Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12269107 | Method for manufacturing composite substrate, and composite substrate | Kunihiko Nishimura, Keisuke Nakamura, Masahiro FUJIKAWA, Tomohiro Shinagawa, Eiji Yagyu | 2025-04-08 |
| 11961765 | Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrate | Kunihiko Nishimura, Masahiro FUJIKAWA, Yuki TAKIGUCHI, Eiji Yagyu | 2024-04-16 |
| 11854856 | Method of manufacturing semiconductor element | Masahiro FUJIKAWA, Kunihiko Nishimura, Eiji Yagyu | 2023-12-26 |
| 11322322 | Insulating molded body and gas circuit breaker | Takashi Kawana, Fumihiko Hosokoshi, Motohiro Sato, Kenji Mimura | 2022-05-03 |
| 6765449 | Pulse width modulation circuit | Kazutaka Murayama, Sadatoshi Hisamoto, Norio Umezu, Yoshitaka Handa | 2004-07-20 |