Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9605192 | Adhesive composition and production method thereof | Sou Saitou, Atsuhiko Umezawa | 2017-03-28 |
| 5248351 | Copper Ni-Si-P alloy for an electronic device | Kenji Kubozono, Takashi Nakagima, Takefumi Itou, Kimio Hashizume | 1993-09-28 |
| 5069979 | Plated copper alloy material | Takashi Nakajima, Akira Yugi | 1991-12-03 |
| 5019185 | Method for producing high strength Cu-Ni-Sn alloy containing manganese | Takashi Nakajima, Kenji Kubozono, Toshihiko Mori, Takefumi Ito, Kimio Hashitsume | 1991-05-28 |
| 4950451 | Copper alloy for an electronic device and method of preparing the same | Takashi Nakajima, Kenji Kubozono, Takefumi Itou, Kimio Hashizume | 1990-08-21 |