Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9005390 | Room temperature bonding apparatus | Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Jun Utsumi, Yoichiro Tsumura +2 more | 2015-04-14 |
| 8985175 | Room temperature bonding machine and room temperature bonding method | Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide +1 more | 2015-03-24 |
| 8906175 | Room temperature bonding apparatus | Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide +1 more | 2014-12-09 |
| 8857487 | Room temperature bonding apparatus | Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Jun Utsumi, Yoichiro Tsumura +2 more | 2014-10-14 |
| 8578993 | Wafer bonding apparatus | — | 2013-11-12 |
| 6783430 | Grinding apparatus using fluid servomotor | — | 2004-08-31 |
| 6267657 | Grinding swarf collector | Hiroshi Yasukura, Yasuhiro Kanai | 2001-07-31 |