Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4848646 | Method for depositing solder onto aluminum metal material | Mitsuharu Morishita, Shiro Iwatani | 1989-07-18 |
| 4417267 | Cooling means for semiconductor device | Hifumi Wada | 1983-11-22 |