Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6308938 | Semiconductor integrated circuit device | — | 2001-10-30 |
| 5661223 | Composition of phenolic resin-modified epoxy resin and straight chain polymer | Seiji Oka, Mitsuhiro Nonogaki, Takumi Kikuchi, Takashi Takahama, Hiroyuki Nakajima | 1997-08-26 |
| 5278259 | Epoxy resin composition, epoxy resin cured material, and laminated sheet lined with copper | Hiroyuki Nakajima, Takashi Takahama | 1994-01-11 |
| 4385952 | Process for preparing fiber reinforced plastics | Hidetoshi Kitakoga | 1983-05-31 |