Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5288698 | Method of positioning lead frame on molding die to seal semiconductor element with resin | Toshinobu Banjo, Minoru Tanaka | 1994-02-22 |
| 5123823 | Molding device for sealing semiconductor element with resin | Toshinobu Banjo, Minoru Tanaka | 1992-06-23 |