Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5844306 | Die pad structure for solder bonding | Takashi Iwata, Tetsuya Kurokawa | 1998-12-01 |
KF
Kazumoto Fujita
Shikoku Instrumentation Co.: 1 patents #5 of 31Top 20%
Overall (All Time): #3,704,721 of 4,157,543Top 90%
1
Patents All Time