Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5610799 | Power module device | — | 1997-03-11 |
| 5563441 | Lead frame assembly including a semiconductor device and a resistance wire | — | 1996-10-08 |
| 5536972 | Power module | — | 1996-07-16 |
| 5460319 | Lead, method of assembling an integrated circuit device, integrated circuit device, lead for providing a conductive path and method of providing a conductive path | — | 1995-10-24 |
| 5459350 | Resin sealed type semiconductor device | Shoji Date, Ziro Honda, Toshiya Nakano | 1995-10-17 |
| 5434449 | Semiconductor device in a single package with high wiring density and a heat sink | Daichi Himeno | 1995-07-18 |
| 5260602 | Hybrid integrated-circuit device having an asymmetrical thermal dissipator | Yoshihiro Fukuba | 1993-11-09 |