Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5532517 | Hybrid integrated circuit device with heat suppression means provided in the vicinity of solder bonding areas | — | 1996-07-02 |
AK
Atunobu Kawamoto
Overall (All Time): #3,746,695 of 4,157,543Top 95%
1
Patents All Time