Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315834 | Electroplated indium bump stacks for cryogenic electronics | Richard P. Rouse | 2025-05-27 |
| 12069967 | Integrated circuit including two substrates with qubits disposed within one of the two substrates | — | 2024-08-20 |
| 11862593 | Electroplated indium bump stacks for cryogenic electronics | Richard P. Rouse | 2024-01-02 |
| 11417819 | Forming a bumpless superconductor device by bonding two substrates via a dielectric layer | — | 2022-08-16 |