Yet Hong Tan

Micron: 2 patents #3,728 of 6,345Top 60%

📍 Boise, ID: #1,893 of 3,546 inventorsTop 55%

🗺 Idaho: #3,799 of 8,810 inventorsTop 45%

Overall (All Time): #1,870,806 of 4,157,543Top 45%

Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
10937682	TCB bond tip design to mitigate top die warpage and solder stretching issue	—	2021-03-02
10312126	TCB bond tip design to mitigate top die warpage and solder stretching issue	—	2019-06-04