Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12045482 | Wordline leakage test management | Wai Leong Chin, Francis Chew, Chun Sum Yeung, Lawrence Dumalag, Ekamdeep Singh | 2024-07-23 |
| 11594522 | Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture | Nathan Joseph Sirocka, Andrew D. Proescholdt | 2023-02-28 |
| 11107795 | Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture | Nathan Joseph Sirocka, Andrew D. Proescholdt | 2021-08-31 |
| 11092990 | Apparatuses and related methods for staggering power-up of a stack of semiconductor dies | — | 2021-08-17 |
| 10388630 | Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture | Nathan Joseph Sirocka, Andrew D. Proescholdt | 2019-08-20 |
| 10120404 | Apparatuses and related methods for staggering power-up of a stack of semiconductor dies | — | 2018-11-06 |
| 9875993 | Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture | Nathan Joseph Sirocka, Andrew D. Proescholdt | 2018-01-23 |
| 9785171 | Apparatuses and related methods for staggering power-up of a stack of semiconductor dies | — | 2017-10-10 |
| 9305905 | Apparatuses and related methods for staggering power-up of a stack of semiconductor dies | — | 2016-04-05 |