Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069655 | Semiconductor device including two or more chips mounted over wiring substrate | Kazuhiko Shibata, Yutaka Kagaya | 2021-07-20 |
| 10537018 | Semiconductor device | — | 2020-01-14 |
| 10431556 | Semiconductor device including semiconductor chips mounted over both surfaces of substrate | Koji Hosokawa | 2019-10-01 |
| 10342118 | Semiconductor device | — | 2019-07-02 |
| 9837377 | Semiconductor device including two or more chips mounted over wiring substrate | Kazuhiko Shibata, Yutaka Kagaya | 2017-12-05 |
| 9799611 | Semiconductor device including semiconductor chips mounted over both surfaces of substrate | Koji Hosokawa | 2017-10-24 |
| 9748204 | Semiconductor device including semiconductor chips stacked over substrate | Koji Hosokawa | 2017-08-29 |
| 9601447 | Semiconductor device including plural semiconductor chips stacked on substrate | — | 2017-03-21 |
| 9418907 | Method for manufacturing semiconductor device | — | 2016-08-16 |
| 9418968 | Semiconductor device including semiconductor chips mounted over both surfaces of substrate | Koji Hosokawa | 2016-08-16 |