Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347732 | Systems and methods for mitigating crack propagation in semiconductor die manufacturing | Wei Yeeng Ng, Rajesh Balachandran, Frank Speetjens, Andrew Li, Sukhdeep Kaur | 2025-07-01 |
| 11637040 | Systems and methods for mitigating crack propagation in semiconductor die manufacturing | Wei Yeeng Ng, Rajesh Balachandran, Frank Speetjens, Andrew Li, Sukhdeep Kaur | 2023-04-25 |