| RE40819 |
Semiconductor device with improved bond pads |
— |
2009-07-07 |
| 6838390 |
Method and apparatus for plasma etching a wafer |
David Johnson, Willard L. Hofer |
2005-01-04 |
| 6424733 |
Method and apparatus for inspecting wafers |
— |
2002-07-23 |
| 6380100 |
Semiconductor processing apparatuses, and methods of forming antireflective coating materials over substrates |
J. Brett Rolfson |
2002-04-30 |
| 6293789 |
Semiconductor processing apparatuses |
J. Brett Rolfson |
2001-09-25 |
| 6248671 |
Semiconductor processing apparatuses, and methods of forming antireflective coating materials over substrates |
J. Brett Rolfson |
2001-06-19 |
| 6080272 |
Method and apparatus for plasma etching a wafer |
David Johnson, Willard L. Hofer |
2000-06-27 |
| 5789754 |
Leak detection method and apparatus for plasma processing equipment |
David A. Cathey |
1998-08-04 |
| 5686762 |
Semiconductor device with improved bond pads |
— |
1997-11-11 |
| 5376235 |
Method to eliminate corrosion in conductive elements |
— |
1994-12-27 |
| 5221414 |
Process and system for stabilizing layer deposition and etch rates while simultaneously maintaining cleanliness in a water processing reaction chamber |
James L. Dale |
1993-06-22 |
| 5217926 |
Method of passivating a semiconductor wafer |
— |
1993-06-08 |
