Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266630 | Bond pad connection layout | Bharat Bhushan, Raj K. Bansal, David Daycock | 2025-04-01 |
| 11876068 | Bond pad connection layout | Bharat Bhushan, Raj K. Bansal, David Daycock | 2024-01-16 |
| 11769756 | Semiconductor assemblies with hybrid fanouts and associated methods and systems | Bharat Bhushan, Raj K. Bansal | 2023-09-26 |
| 11502053 | Bond pad connection layout | Bharat Bhushan, Raj K. Bansal, David Daycock | 2022-11-15 |
| 11450645 | Semiconductor assemblies with hybrid fanouts and associated methods and systems | Bharat Bhushan, Raj K. Bansal | 2022-09-20 |