JH

Joe W. Hodges

Micron: 4 patents #2,657 of 6,345Top 45%
📍 Boise, ID: #1,368 of 3,546 inventorsTop 40%
🗺 Idaho: #2,529 of 8,810 inventorsTop 30%
Overall (All Time): #1,280,577 of 4,157,543Top 35%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6107680 Packaging for bare dice employing EMR-sensitive adhesives 2000-08-22
5976955 Packaging for bare dice employing EMR-sensitive adhesives 1999-11-02
5775510 UV light sensitive die-pac for securing semiconductor dice during transport 1998-07-07
5590787 UV light sensitive die-pac for securing semiconductor dies during transport 1997-01-07