Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6015083 | Direct solder bumping of hard to solder substrate | Donald J. Hayes, Virang G. Shah | 2000-01-18 |
| 5772106 | Printhead for liquid metals and method of use | Scott Ayers, Donald J. Hayes, David B. Wallace | 1998-06-30 |
| 5229016 | Method and apparatus for dispensing spherical-shaped quantities of liquid solder | Donald J. Hayes, David B. Wallace | 1993-07-20 |