Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9048104 | Multi-chip package module and a doped polysilicon trench for isolation and connection | Benedict C. K. Choy, Ching Chu, Ming-Yuan Yeh | 2015-06-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9048104 | Multi-chip package module and a doped polysilicon trench for isolation and connection | Benedict C. K. Choy, Ching Chu, Ming-Yuan Yeh | 2015-06-02 |