Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6881904 | Heat-Shrinkable EMI/RFI shielding material | Emil Millas, Albert Chiapetta | 2005-04-19 | $3,300,000 |
| 6692664 | Printed wiring board conductive via hole filler having metal oxide reducing capability | — | 2004-02-17 | $4,329,000 |
| 6337037 | Printed wiring board conductive via hole filler having metal oxide reducing capability | — | 2002-01-08 | |
| 5761803 | Method of forming plugs in vias of a circuit board by utilizing a porous membrane | Felix Rodriguez, Susan Christensen | 1998-06-09 | |
| 4595606 | Solderable conductive compositions having high adhesive strength | Samson Shahbazi | 1986-06-17 | $4,108,000 |
| 4548879 | Solderable polymer thick films | Wayne A. Martin | 1985-10-22 | $6,060,000 |