Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8011226 | Leakage detection method using micromachined-thermal-convection accelerometer | Zongya Li, Hanwu Xiao | 2011-09-06 |
| 7495462 | Method of wafer-level packaging using low-aspect ratio through-wafer holes | Zongya Li, Yang Zhao | 2009-02-24 |
| 7424826 | Single chip tri-axis accelerometer | Leyue Jiang, Yongyao Cai, Albert Leung, Yang Zhao | 2008-09-16 |
| 6712983 | Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same | Yang Zhao | 2004-03-30 |