Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5049221 | Process for producing a copper-clad laminate | Tatsuo Wada, Keizo Yamashita, Teruaki Yamamoto | 1991-09-17 |
| 4790902 | Method of producing conductor circuit boards | Tatsuo Wada, Keizo Yamashita, Teruaki Yamamoto | 1988-12-13 |
| 4323441 | Apparatus for electroplating strip material without current leakage | Glenn R. Schaer, Teruaki Yamamoto, Keisuke Honda, Tatsuo Wada | 1982-04-06 |