Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6350957 | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Noboru Shingai, Tatsuo Wada | 2002-02-26 |
| 6239983 | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Noboru Shingai, Tatsuo Wada | 2001-05-29 |
| 5886877 | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Noboru Shingai, Tatsuo Wada | 1999-03-23 |