Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7045390 | Stacked die package | Robert L. Hubbard | 2006-05-16 |
| 6991961 | Method of forming a high-voltage/high-power die package | Robert L. Hubbard | 2006-01-31 |
| 6963780 | Implantable medical device including a surface-mount terminal array | David A. Ruben, Andrew J. Ries, Randy S. Roles, Terry W. Bruneau, Steve Craig Warren +4 more | 2005-11-08 |
| 6836022 | High voltage flip-chip component package and method for forming the same | Mark R. Boone, Andreas Fenner, Lary R. Larson | 2004-12-28 |
| 6696318 | Methods for forming a die package | — | 2004-02-24 |
| 6670217 | Methods for forming a die package | Mark R. Boone | 2003-12-30 |
| 6626931 | Implantable medical electronics using high voltage flip chip components | Mark R. Boone | 2003-09-30 |
| 6057175 | Method of making encapsulated package | Mark R. Boone | 2000-05-02 |
| 5674258 | Packaged integrated accelerometer | Mark E. Henschel, Kelly Consoer, James M. Sikorski, Larry R. Larson | 1997-10-07 |