Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7215025 | Wafer scale semiconductor structure | — | 2007-05-08 |
| 7205181 | Method of forming hermetic wafer scale integrated circuit structure | — | 2007-04-17 |
| 7205635 | Hermetic wafer scale integrated circuit structure | — | 2007-04-17 |
| 7038478 | Stress relieved contact array | — | 2006-05-02 |
| 6982475 | Hermetic wafer scale integrated circuit structure | — | 2006-01-03 |
| 6838894 | Stress relieved contact array | — | 2005-01-04 |
| 6753208 | Wafer scale method of packaging integrated circuit die | — | 2004-06-22 |
| 6690088 | Integrated circuit package stacking structure | — | 2004-02-10 |
| 6555469 | Chip scale packages | — | 2003-04-29 |