Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12410525 | Multilayer corrosion system | Adam Colburn, Bradley Durkin, Maurice Mills, Ambrose Schaffer | 2025-09-09 |
| 11913131 | Ternary zinc-nickel-iron alloys and alkaline electrolytes or plating such alloys | Tony Oriti, Markus Jahn | 2024-02-27 |
| 11555252 | Satin copper bath and method of depositing a satin copper layer | Claire Theuret | 2023-01-17 |
| 11047064 | Apparatus and method to maintaining trivalent chromium bath plating | — | 2021-06-29 |
| 10167564 | Apparatus and methods of maintaining trivalent chromium bath plating efficiency | — | 2019-01-01 |
| 10062918 | Flow battery electrolyte compositions containing a chelating agent and a metal plating enhancer | Nicholas Williams, John J. Curley, Hooman Hafezi, Stephen Joseph Carpmail, Joseph Brian Apisdorf | 2018-08-28 |
| 7195702 | Tin alloy electroplating system | William E. Eckles, Robert E. Frischauf | 2007-03-27 |
| 6720499 | Tin whisker-free printed circuit board | Craig V. Bishop, John R. Kochilla | 2004-04-13 |
| 6676823 | High speed acid copper plating | — | 2004-01-13 |
| 6602440 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | Craig V. Bishop, Robert Jeffrey Durante, John R. Kochilla | 2003-08-05 |
| 6579591 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | Craig V. Bishop, Robert Jeffrey Durante, John R. Kochilla | 2003-06-17 |
| 6506314 | Adhesion of polymeric materials to metal surfaces | Dickson L. Whitney, Jr., Craig V. Bishop, Americus C. Vitale | 2003-01-14 |
| 6361823 | Process for whisker-free aqueous electroless tin plating | Craig V. Bishop, John R. Kochilla | 2002-03-26 |
| 6284309 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | Craig V. Bishop, Robert Jeffrey Durante, John R. Kochilla | 2001-09-04 |
| 6086779 | Copper etching compositions and method for etching copper | Craig V. Bishop, John R. Kochilla, Robert Jeffrey Durante | 2000-07-11 |
| 6063172 | Aqueous immersion plating bath and method for plating | William J. Willis | 2000-05-16 |
| 5928790 | Multilayer circuit boards and processes of making the same | — | 1999-07-27 |
| 5698087 | Plating bath and method for electroplating tin and/or lead | — | 1997-12-16 |
| 5554211 | Aqueous electroless plating solutions | William J. Willis | 1996-09-10 |
| 5411595 | Post-etch, printed circuit board cleaning process | Gary W. Loar, Americus C. Vitale | 1995-05-02 |
| 4885064 | Additive composition, plating bath and method for electroplating tin and/or lead | Billie J. Page | 1989-12-05 |
| 4662999 | Plating bath and method for electroplating tin and/or lead | Vincent C. Opaskar | 1987-05-05 |