Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074099 | Microelectronics package assemblies and processes for making | Christopher W. Johnson, ZhenWei Tee, Noel De Leon, SinLi Tan | 2024-08-27 |
| 12020999 | Cover lid with selective and edge metallization and methods of making | — | 2024-06-25 |
| 11049777 | Ceramic combo lid with selective and edge metallizations | — | 2021-06-29 |
| 11031309 | Cover lid with selective and edge metallization | — | 2021-06-08 |
| 10357841 | Metal cap assembly for optical communications | Chee Kong Lee | 2019-07-23 |
| 10211115 | Method of making a ceramic combo lid with selective and edge metallizations | — | 2019-02-19 |
| 9560781 | Metal cap assembly for optical communications | Chee Kong Lee | 2017-01-31 |
| 8975176 | Gold die bond sheet preform | — | 2015-03-10 |