Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391744 | Method of fabricating a non-SOI device on an SOI starting wafer and thinning the same | John J. Hudak, Jr., Thomas R. Neal | 2002-05-21 |
| 5116771 | Thick contacts for ultra-thin silicon on insulator films | — | 1992-05-26 |
| 4507852 | Method for making a reliable ohmic contact between two layers of integrated circuit metallizations | — | 1985-04-02 |