JH

Judy L. Hoyt

MIT: 5 patents #953 of 9,367Top 15%
HP HP: 3 patents #1,644 of 7,018Top 25%
Stanford University: 2 patents #1,252 of 5,197Top 25%
SU Stanford University: 1 patents #58 of 261Top 25%
📍 Belmont, MA: #220 of 1,163 inventorsTop 20%
🗺 Massachusetts: #11,548 of 88,656 inventorsTop 15%
Overall (All Time): #461,784 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
9269633 Method for forming gate electrode with depletion suppression and tunable workfunction Steven Hung, James F. Gibbons 2016-02-23
7920770 Reduction of substrate optical leakage in integrated photonic circuits through localized substrate removal Charles W. Holzwarth, Jason S. Orcutt, Milos Popovic, Rajeev Ram 2011-04-05
7867859 Gate electrode with depletion suppression and tunable workfunction Steven Hung, James F. Gibbons 2011-01-11
6921914 Process for producing semiconductor article using graded epitaxial growth Zhi-Yuan Cheng, Eugene A. Fitzgerald, Dimitri Antoniadis 2005-07-26
6737670 Semiconductor substrate structure Zhi-Yuan Cheng, Eugene A. Fitzgerald, Dimitri Antoniadis 2004-05-18
6713326 Process for producing semiconductor article using graded epitaxial growth Zhi-Yuan Cheng, Eugene A. Fitzgerald, Dimitri Antoniadis 2004-03-30
6573126 Process for producing semiconductor article using graded epitaxial growth Zhi-Yuan Cheng, Eugene A. Fitzgerald, Dimitri Antoniadis 2003-06-03
5256550 Fabricating a semiconductor device with strained Si.sub.1-x Ge.sub.x layer Stephen Laderman, Martin Scott, Theodore I. Kamins, Clifford A. King, James F. Gibbons +1 more 1993-10-26
5202284 Selective and non-selective deposition of Si.sub.1-x Ge.sub.x on a Si subsrate that is partially masked with SiO.sub.2 Theodore I. Kamins, David B. Noble, James F. Gibbons, Martin Scott 1993-04-13
5084411 Semiconductor processing with silicon cap over Si.sub.1-x Ge.sub.x Film Stephen Laderman, Martin Scott, Theodore I. Kamins, Clifford A. King, James F. Gibbons +1 more 1992-01-28
4787551 Method of welding thermocouples to silicon wafers for temperature monitoring in rapid thermal processing Kenneth E. Williams, James F. Gibbons 1988-11-29