Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901322 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Jae Sik Choi | 2024-02-13 |
| 11380640 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Jae Sik Choi | 2022-07-05 |
| 10910270 | Method of forming and packaging semiconductor die | Jae Sik Choi, Jin Won Jeong, Dong Ki Shim, Jin Han BAE | 2021-02-02 |
| 10741521 | Semiconductor package and method of manufacturing semiconductor package | Jae Sik Choi, Jin Won Jeong, Do-Young Kim, Hye Ji Lee | 2020-08-11 |