Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9994967 | Copper film with large grains, copper clad laminate having the same and manufacturing method of copper clad laminate | Chih-Jung Chen | 2018-06-12 |
| 9153570 | ESD tolerant I/O pad circuit including a surrounding well | Shih-Yu Wang, Yan-Yu Chen, Yu-Lien Liu, Tao-Cheng Lu | 2015-10-06 |
| 8952457 | Electrostatic discharge protection circuit | Shih-Yu Wang, Yan-Yu Chen, Yu-Lien Liu, Tao-Cheng Lu | 2015-02-10 |
| 8748936 | Methods and structures for electrostatic discharge protection | Shih-Yu Wang, Yan-Yu Chen, Yu-Lien Liu, Tao-Cheng Lu | 2014-06-10 |
| 8345396 | Electrostatic discharge protectors having increased RC delays | Shih-Yu Wang, Yu-Lien Liu, Yan-Yu Chen, Che-Shih Lin, Tao-Cheng Lu | 2013-01-01 |
| 8253165 | Structures for lowering trigger voltage in an electrostatic discharge protection device | Shih-Yu Wang, Yan-Yu Chen, Yu-Lien Liu, Tao-Cheng Lu | 2012-08-28 |
| 7643258 | Methods and apparatus for electrostatic discharge protection in a semiconductor circuit | Chun-Hsiang Lai | 2010-01-05 |
| 7573102 | ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad | Meng-Huang Liu, Chun-Hsiang Lai, Shin Su, Yen-Hung Yeh, Tao-Cheng Lu | 2009-08-11 |
| 7291870 | Electrostatic protection circuit | Chun-Hsiang Lai, Shin Su, Yen-Hung Yeh, Tao-Cheng Lu | 2007-11-06 |
| 7193274 | ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad | Meng-Huang Liu, Chun-Hsiang Lai, Shin Su, Yen-Hung Yeh, Tao-Cheng Lu | 2007-03-20 |
| 7087968 | Electrostatic discharge protection circuit and semiconductor circuit therewith | Chun-Hsiang Lai, Yen-Hung Yeh | 2006-08-08 |
| 7012305 | Electro-static discharge protection circuit for dual-polarity input/output pad | Shin Su, Chun-Hsiang Lai, Yen-Hung Yeh, Tao-Cheng Lu | 2006-03-14 |