Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406609 | Opening structure and manufacturing method thereof and interconnection structure | — | 2016-08-02 |
| 9252153 | Method of word-line formation by semi-damascene process with thin protective conductor layer | An Chyi Wei, Ta-Hung Yang | 2016-02-02 |