Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764163 | Semiconductor encapsulation structure and encapsulation method | Xiaolei Zhou, Peng Liu | 2023-09-19 |
| 11530331 | Functional ink suitable for 3D printing and preparation method thereof | Chuhong Zhang, Li Zeng, Shangwen Ling | 2022-12-20 |
| 11527487 | Package structure and method of manufacturing the same | Xiaolei Zhou, Peng Liu | 2022-12-13 |