Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10656355 | Heat dissipation structure of horizontal optical-communication sub-assembly | Pi-Cheng Law, Po-Chao Huang, Ya-Hsin Deng, Hua-Hsin Su | 2020-05-19 |
| 9991674 | Optical transmitter with a heat dissipation structure | Pi-Cheng Law, Po-Chao Huang, Chung-Hsin Fu, Hua-Hsin Su | 2018-06-05 |
| 9854674 | Flexible printed circuit and printed circuit board soldered structure | Ho-I Chen, Yi-Ching Chiu, BO LIU, Hua-Hsin Su | 2017-12-26 |