Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5550087 | Process for bonding a semiconductor die to a variable die size inner lead layout | — | 1996-08-27 |
| 5489059 | Semiconductor device having an universal die size inner lead layout | Michael D. Rostoker | 1996-02-06 |
| 5399903 | Semiconductor device having an universal die size inner lead layout | Michael D. Rostoker | 1995-03-21 |
| 5168345 | Semiconductor device having a universal die size inner lead layout | — | 1992-12-01 |