Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5763952 | Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same | Brian Lynch | 1998-06-09 |
| 5681777 | Process for manufacturing a multi-layer tab tape semiconductor device | Brian Lynch | 1997-10-28 |
| 5639385 | Method of fabricating a wafer probe card for testing an integrated circuit die | — | 1997-06-17 |
| 5638596 | Method of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power plane | — | 1997-06-17 |
| 5552631 | Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die | — | 1996-09-03 |
| 5550406 | Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate | — | 1996-08-27 |
| 5410451 | Location and standoff pins for chip on tape | Emily Hawthorne | 1995-04-25 |
| D341129 | Remotely located controller | — | 1993-11-09 |