Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7204920 | Contact ring design for reducing bubble and electrolyte effects during electrochemical plating in manufacturing | Byung Sung Kwak, Hiroshi Mizuno | 2007-04-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7204920 | Contact ring design for reducing bubble and electrolyte effects during electrochemical plating in manufacturing | Byung Sung Kwak, Hiroshi Mizuno | 2007-04-17 |