Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635424 | High-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads | Michael D. Rostoker | 1997-06-03 |
| 5565385 | Semiconductor bond pad structure and increased bond pad count per die | Michael D. Rostoker | 1996-10-15 |
| 5441917 | Method of laying out bond pads on a semiconductor die | Michael D. Rostoker | 1995-08-15 |
| 5404047 | Semiconductor die having a high density array of composite bond pads | Michael D. Rostoker | 1995-04-04 |
| 5284797 | Semiconductor bond pads | — | 1994-02-08 |
| 5248903 | Composite bond pads for semiconductor devices | — | 1993-09-28 |