Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12227645 | Polyamide resin composition and molded product comprising same | Sang Hwa Lee, Yeong Deuk SEO | 2025-02-18 |
| 11816579 | Method and apparatus for detecting defect pattern on wafer based on unsupervised learning | Min Sik Chu, Seong Mi Park, Jiin Jeong, Jae Hoon Kim, Kyong-Hee Joo +1 more | 2023-11-14 |
| 11587222 | Method and apparatus for detecting defect pattern on wafer based on unsupervised learning | Min Sik Chu, Seong Mi Park, Jiin Jeong, Jae Hoon Kim, Kyong-Hee Joo +1 more | 2023-02-21 |
| 11292910 | Thermoplastic mica-filled polycarbonate resin composition and article produced therefrom | Eun Taek Woo, Sun Young Kim, Seung Shik SHIN | 2022-04-05 |