Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE43607 | Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects | Tushar K. Shah | 2012-08-28 |
| 6900654 | Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects | Tushar K. Shah | 2005-05-31 |
| 6221682 | Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects | Tushar K. Shah | 2001-04-24 |