Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9237655 | Material deposition on circuit card assemblies | — | 2016-01-12 |
| 8918990 | Method of forming a solderless printed wiring board | — | 2014-12-30 |
| 6400570 | Plated through-holes for signal interconnections in an electronic component assembly | — | 2002-06-04 |
| 6011691 | Electronic component assembly and method for low cost EMI and capacitive coupling elimination | — | 2000-01-04 |