Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7041771 | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering | — | 2006-05-09 |
| 6819004 | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering | — | 2004-11-16 |
| 6615484 | Method of manufacturing an electrical connection using solder flux compatible with flip chip underfill material | — | 2003-09-09 |
| 6367150 | Solder flux compatible with flip-chip underfill material | — | 2002-04-09 |