Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7117587 | Method for fabricating a substrate, including a plurality of chip package substrates | Huei-Jen Chen, Yvon Chen | 2006-10-10 |
| 7075176 | Chip package substrate having soft circuit board and method for fabricating the same | Huei-Jen Chen, Yvon Chen | 2006-07-11 |