Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406960 | Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate | Hidekazu Nakayama, Yosuke Sato | 2025-09-02 |
| 12288768 | Method of manufacturing laminate | Hidekazu Nakayama, Yosuke Sato | 2025-04-29 |
| 11948865 | Film-shaped firing material and film-shaped firing material with a support sheet | Takeshi Mori, Hidekazu Nakayama | 2024-04-02 |
| 11707787 | Film-shaped firing material, film-shaped firing material provided with support sheet, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material provided with support sheet | — | 2023-07-25 |
| 11420255 | Film-shaped firing material and film-shaped firing material with a support sheet | Hidekazu Nakayama | 2022-08-23 |
| 11285536 | Film-shaped fired material, and film-shaped fired material with support sheet | Hidekazu Nakayama | 2022-03-29 |
| 11267992 | Film-shaped firing material and film-shaped firing material with support sheet | Hidekazu Nakayama, Akinori Sato | 2022-03-08 |
| 11219946 | Firing material composition, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material with support sheet | Takeshi Mori, Hidekazu Nakayama, Yukiharu Nose | 2022-01-11 |
| 10131824 | Adhesive composition, adhesive sheet, and method for producing semiconductor device | Sayaka Tsuchiyama | 2018-11-20 |
| 9562179 | Adhesive composition, adhesive sheet and production process for semiconductor device | Naoya Saiki, Hironori Shizuhata, Osamu Yamazaki | 2017-02-07 |
| 9434865 | Adhesive composition, an adhesive sheet and a production method of a semiconductor device | Sayaka Tsuchiyama | 2016-09-06 |
| 9382455 | Adhesive composition, an adhesive sheet and a production method of a semiconductor device | Sayaka Tsuchiyama | 2016-07-05 |
| 9296925 | Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device | Yoji Wakayama, Takashi Akutsu | 2016-03-29 |
| 9184082 | Adhesive composition, adhesive sheet and production process for semiconductor device | Naoya Saiki, Hironori Shizuhata, Osamu Yamazaki | 2015-11-10 |
| 8716401 | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | Yasunori Karasawa | 2014-05-06 |
| 8703585 | Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device | Masaaki Furudate, Mikihiro Kashio, Sou Miyata, Kaisuke Yanagimoto, Yuichi Kozone | 2014-04-22 |
| 8545663 | Process for manufacturing semiconductor devices | Osamu Yamazaki, Naoya Saiki | 2013-10-01 |
| 8247503 | Adhesive composition and adhesive sheet | Naoya Saiki, Hironori Shizuhata | 2012-08-21 |
| 7851335 | Adhesive composition, adhesive sheet and production method of semiconductor device | Naoya Saiki, Hironori Shizuhata | 2010-12-14 |
| 7842551 | Adhesive composition, adhesive sheet and production process for semiconductor device | Naoya Saiki, Hironori Shizuhata, Osamu Yamazaki | 2010-11-30 |
| 7674859 | Adhesive composition and adhesive sheet | Naoya Saiki, Hironori Shizuhata | 2010-03-09 |