Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884596 | Method for producing granules for ceramic production | Tsuyoshi Ikeda | 2024-01-30 |
| 9534151 | Sheet and adhesive sheet | Tsutomu Iida, Tomohide Fukuzaki | 2017-01-03 |
| 9102833 | Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body | Masaharu Ito, Wataru Iwaya, Naoki Taya | 2015-08-11 |
| 9023913 | Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body | Masaharu Ito, Wataru Iwaya, Naoki Taya | 2015-05-05 |
| 8212345 | Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure | Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Takeshi Segawa | 2012-07-03 |
| 8182649 | Fixed jig, chip pickup method and chip pickup apparatus | Kenichi Watanabe, Takeshi Segawa | 2012-05-22 |
| 7875501 | Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure | Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Takeshi Segawa | 2011-01-25 |