Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10586757 | Exposed solderable heat spreader for flipchip packages | — | 2020-03-10 |
| 9691681 | Laser drilling encapsulated semiconductor die to expose electrical connection therein | — | 2017-06-27 |
| 9431319 | Exposed, solderable heat spreader for integrated circuit packages | Leonard Shtargot, David R. Ng, Jeffrey Kingan Witt | 2016-08-30 |
| 8017447 | Laser process for side plating of terminals | — | 2011-09-13 |