Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1086507 | Light emitting diode package | Yi-Wen Chen, I-Hsin Tung | 2025-07-29 |
| D1080931 | Light emitting diode package | Yi-Wen Chen, I-Hsin Tung | 2025-06-24 |
| 12260049 | Touch light-emitting module having hallowed portion for incapsulation resin and manufacturing method thereof | Yi-Wen Chen, I-Hsin Tung | 2025-03-25 |
| 12008202 | Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof | Yi-Wen Chen, I-Hsin Tung | 2024-06-11 |