Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666733 | Solar cell using printed circuit board | Hyeon-Woo Ahn | 2017-05-30 |
| 8426739 | Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board | Kwang Tae Lee, Jae Bong Choi | 2013-04-23 |
| 7337535 | Hole plugging method for printed circuit boards, and hole plugging device | Sung Sik Cho, Yong-Il Kim, Yong Soon Jang, Ho Sung Choi, Sang Jin Kong +1 more | 2008-03-04 |
| 7320173 | Method for interconnecting multi-layer printed circuit board | Jung Ho Hwang, Joon Wook Han, Sang Min Lee, Tae-Sik Eo, Yu-Seock Yang | 2008-01-22 |
| 7304249 | Bonding pads for a printed circuit board | Yong-Il Kim | 2007-12-04 |
| 7257891 | Method for forming bonding pads | Yong-Il Kim | 2007-08-21 |
| 7208341 | Method for manufacturing printed circuit board | Kwang Tae Lee, Sang Hyuck NAM, Sung-Ho Youn, Young Kyu Lee | 2007-04-24 |
| 7189302 | Multi-layer printed circuit board and fabricating method thereof | Jung Ho Hwang, Sang Min Lee, Joon Wook Han, Tae-Sik Eo, Yu-Seock Yang | 2007-03-13 |
| 7098533 | Printed circuit board with a heat dissipation element and package comprising the printed circuit board | Yong-Il Kim | 2006-08-29 |
| 7049178 | Method for fabricating semiconductor package and semiconductor package | Yong-Il Kim, Yu-Seock Yang | 2006-05-23 |
| 6954985 | Method for plugging holes in a printed circuit board | Sung Sik Cho, Yong-Il Kim, Yong Soon Jang, Ho Sung Choi, Sang Jin Kong +1 more | 2005-10-18 |
| 6851184 | Method for manufacturing a printed circuit board | Yong-Il Kim, Yong Soon Jang | 2005-02-08 |
| 6849294 | Method for fabricating circuit pattern of printed circuit board | — | 2005-02-01 |
| 6803257 | Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board | Yong-Il Kim | 2004-10-12 |
| 6740352 | Method for forming bonding pads | Yong-Il Kim | 2004-05-25 |
| 6706564 | Method for fabricating semiconductor package and semiconductor package | Yong-Il Kim, Yu-Seock Yang | 2004-03-16 |
| 6641983 | Method for forming exposed portion of circuit pattern in printed circuit board | Yong Soon Jang, Won-Hyeog Jin | 2003-11-04 |
| 6509634 | Chip mounting structure having adhesive conductor | Yong-Il Kim | 2003-01-21 |
| 6210518 | Method and fixture for manufacturing flexible printed circuit board | Hyung-kun Kim | 2001-04-03 |