CC

Chan Yeup Chung

LG: 9 patents #4,845 of 26,165Top 20%
LS Lg Energy Solution: 1 patents #1,129 of 1,886Top 60%
YC Ymt Co.: 1 patents #3 of 20Top 15%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #451,171 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
11427926 Silicon-based molten composition and method for manufacturing silicon carbide single crystal using the same Ho Rim Lee, Kyoung-Hoon Kim, Jung Ko 2022-08-30
11380891 Cathode active material for secondary battery and secondary battery comprising same Eun-Kyung Park, Min Chul Jang, Da Young Sung, Chang Hun Park 2022-07-05
11203818 Silicon based fusion composition and manufacturing method of silicon carbide single crystal using the same Ho Rim Lee, Manshik Park, Jung Ko 2021-12-21
11193217 Silicon-based molten composition and method for manufacturing silicon carbide single crystal using the same Junghwan Kim, Ho Rim Lee, Jung Ko, Manshik Park 2021-12-07
10854912 Sulfide-based solid electrolyte and all-solid-state battery applied therewith Da Young Sung, Su Hwan Kim, Jong Hyun Chae, Doo Kyung Yang 2020-12-01
10718065 Silicon-based molten composition and manufacturing method of SiC single crystal using the same Jung Ko, Dae Sung Kim, Sung-Soo Lee, Chang Sun Eun 2020-07-21
10662547 Silicon-based molten composition and manufacturing method of SiC single crystal using the same Ho Rim Lee, Jung Ko, Dae Sung Kim, Sung-Soo Lee, Chang Sun Eun 2020-05-26
10651401 Method for preparing light absorber of solar cell Ji Hye Kim, Sung-Ho Chun, Jung Ha Park, Tae Seob LEE 2020-05-12
10349527 Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon Chee Sung Park, Han Nah Jeong, Sang Yun Jung, Cheol Hee Park, Jae-Hyun Kim +1 more 2019-07-09
9561959 Compound semiconductors and their applications O-Jong Kwon, Tae Hoon Kim, Cheol Hee Park, Kyung Moon Ko 2017-02-07
7981317 Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same Young-Ho Lee, Steve Chun, Dek-Gin Yang, Yun-Seok Hwang, Keun-Ho Kim 2011-07-19