Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6013109 | Crack-resistance semiconductor package and fabrication method thereof and fabrication apparatus thereof | — | 2000-01-11 |
| 5871782 | Transfer molding apparatus having laminated chase block | — | 1999-02-16 |
| 5753857 | Charge coupled device (CCD) semiconductor chip package | — | 1998-05-19 |
| 5693573 | Semiconductor package lead deflash method | — | 1997-12-02 |